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Dongguan Xingqiang Circuit Board Technology Co., Ltd.
Dongguan Xingqiang Circuit Board Technology Co., Ltd.
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4 Layer Solderable PCB Board HASL/OSP/ENIG Treatment Customized services

Dongguan Xingqiang Circuit Board Technology Co., Ltd.
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4 Layer Solderable PCB Board HASL/OSP/ENIG Treatment Customized services

Brand Name : xingqiang

Model Number : Varies by goods condition

Certification : ROHS, CE

Place of Origin : China

MOQ : Sample,1 pc(5 square meters)

Price : NA

Payment Terms : ,T/T,Western Union

Supply Ability : 3000㎡

Delivery Time : 12-15 work days

Min. Solder Mask Clearance : 0.1mm

Pcba Standard : IPC-A-610E

Aspect Ratio : 20:1

Board Thinkness : 1.2mm

Minimum Line Space : 3mil (0.075mm)

Surface Finishing : HASL/OSP/ENIG

Materila : FR4

Product : Print Circuit Board

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FR4 solderable 4-layer board PCB


Product Description:

Multilayer printed circuit boards (PCB) are a common type of circuit board in modern electronic devices. They consist of multiple single-sided or double-sided circuit boards stacked together with insulating materials in between, forming a single unit. Each layer of circuits is composed of different circuit layers, and these layers are connected together through vias or interconnecting lines. Compared with single-sided and double-sided PCBs, multi-layer PCBs can achieve more circuit wiring in a smaller space and are suitable for more complex and function-intensive circuit designs.


Advantages of Multilayer PCB:

  • High Density
  • Improved Signal Integrity
  • Better Electromagnetic Compatibility (EMC)
  • Adapt to high-frequency applications
  • Better thermal management
  • Complexity and Cost


Applications:

• Telecommunications

• Computers

• Automotive electronics

• Medical devices

• Consumer electronics

• Aerospace

• Industrial control


Manufacturing process:

  • Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
  • Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
  • Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
  • Etching: On each layer of the circuit, use photolithography and etching techniques to form the circuit pattern, removing excess copper foil
  • Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).




Product Tags:

Custom Size 4 Layer PCB Board

      

FR4 Solderable 4 Layer PCB Board

      
 4 Layer Solderable PCB Board HASL/OSP/ENIG Treatment Customized services Manufactures

4 Layer Solderable PCB Board HASL/OSP/ENIG Treatment Customized services Images

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